| 摘要 |
PURPOSE:To use metal of low resistance and low melting point in the manufacture of a ceramic multilayer circuit board by a method wherein material of high volatility is filled in a through-hole bored in a ceramic green sheet, a conductor circuit pattern formed of the same material is provided to the surface of the green sheet, the ceramic green sheets are laminated and sintered to evaporate the material concerned, and melt of gold or the like is poured in a gap produced by evaporation. CONSTITUTION:Through-holes 2 are bored in a ceramic green sheet, and then highly volatile material which is evaporated at the sintering temperature of the green sheet is filled into the through-holes 2, and a conductor circuit pattern of highly volatile material is formed on the surface of the green sheet. The green sheets are laminated and sintered to remove the highly volatile material by evaporation. Melt of at least one metal selected out of gold, silver, and copper is poured in a gap 3 produced by sintering to form a conductor circuit and also filled into the through-hole 2. Thus a ceramic multilayer circuit board of this constitution can be kept high in thermal conductivity and free from a signal propagation delay. |
