Application of protective layer, esp. for test probes

摘要

Application process for a protective layer, esp. for test probes, comprises joining protection plate to a carrier surface. The protection plate (27) is sandwiched between the carrier surface (26) and a counter plate (29), the three components (26,27,29) are heated and joined together by soldering and the counter plate (29) and its solder layer is removed from the protection plate (27) after cooling. A protection element is also claimed.