Adhesive for semiconductor device and reinforcing material using the same.

摘要

An adhesive (7) for bonding a reinforcing sheet (8) to a lead-formed surface (9), especially in a tape carrier package used for forming a semiconductor device (2), the adhesive (7) being a resin composition which constitutes an interlayer between the lead-formed surface (9) and the reinforcing sheet (8), comprises a polyamide resin having an amine value of 3.0 to 50 and an epoxy resin. The adhesive layer (7) is free from peeling and foaming, undergoes sufficient softening and curing at a temperature lower than about 150 DEG C, has high insulation reliability after curing, and has heat resistance against a temperature up to 260 DEG C.