| 摘要 |
A method for testing electronic devices attached to a leadframe includes positioning more than one electronic device (42, 44, 46) attached to a common leadframe underneath a test fixture (50). The test fixture (50) then contacts the devices (42, 44, 46) to perform an electrical test. Testing more than one device at a time while they are attached to a common leadframe greatly improves efficiency of the testing process. Furthermore, positioning the devices (42, 44, 46) below the test fixture (50) reduces the amount of contamination that may settle on the test fixture. The leadframes may be transported by a walking beam 36 between storage areas 30, 64. <IMAGE> |
