| 摘要 |
PURPOSE:To obtain a copper-plated laminated board having no smear, no swell, flame retardance, impregnation, preservation stability of prepreg, and excellent moldability by superposing a plurality of prepregs in which a base material is impregnated with epoxy resin composition and dried, disposing a copper foil on at least one side surface, heating and integrally molding it under pressure. CONSTITUTION:A plurality of prepregs in which a base material is impregnated with epoxy resin composition obtained by reacting bisphenol A type epoxy resin, tetrabrombisphenol A, and novolac type epoxy resin containing 30wt.% or more of trinuclear novolac type epoxy and tetranuclear novolac type epoxy as main ingredients, and dried, are superposed, a copper foil is disposed on at least one side surface, heated and integrally molded under pressure. Thus, a copper-plated laminated board having excellent heat resistance, sufficient resistance against smear due to acceleration of drilling, and no swell at the time of soldering due to moisture absorption after the board is processed, is obtained. |
