发明名称 |
Mold device for fabricating disc substrate |
摘要 |
A metal mold device for molding a disc substrate formed by molding a synthetic resin material and having a raised portion on the inner surface of the disc substrate, includes a fixed metal mold and a movable metal mold for defining together a mold cavity for molding the disc substrate. A mold releasing resistance in the form of suitably sized projections or recesses, is provided at a portion of the fixed metal mold or the movable metal mold mating with the outer rim of the disc substrate being molded or at the outer peripheral surface of the raised portion to permit an as-molded disc substrate to be released easily and reliably from a stamper bearing a pattern of pits and lands or pre-grooves and to prevent molding distortions from being produced in the disc substrate being molded.
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申请公布号 |
US5427520(A) |
申请公布日期 |
1995.06.27 |
申请号 |
US19930004278 |
申请日期 |
1993.01.14 |
申请人 |
SONY CORPORATION |
发明人 |
SHIMIZU, JUN;KUDO, JUNICHIRO |
分类号 |
B29C33/44;B29C45/26;B29D17/00;G11B7/26;(IPC1-7):B29C45/38;B29C45/40 |
主分类号 |
B29C33/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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