| 摘要 |
<p>PURPOSE:To manufacture a highly reliable IC card by a method wherein a recessed part of IC module size is formed at the desired position on one side of a card base material, the thickness of which is larger than that of an IC module, so as to bond the IC module to the recessed part with an adhesive under the condition that the surface of the base material becomes nearly flush with the electrode surface of the IC module. CONSTITUTION:An IC module 10 having an electrode surface, which comes into contact with an external connecting terminal, on its surface is imbedded in a card base material 11. At that time, a recessed part of the IC module side is formed at the desired position on at least one side of the card base material 11 prepared by punching the base material, the thickness of which is larger than that of the IC module 10, so as to bond the IC module 10 to the recessed part with an adhesive 15 and, at the same time, make the surface of the card base material 11 flush with the electrode of the IC module 10. As a result, the sure connection between the IC module and the card base material can be realized, resulting in allowing to manufacture an IC card having high planar accuracy and reliability.</p> |
