发明名称 |
Method of producing a polyimide multilayer wiring board |
摘要 |
A polyimide multilayer wiring board is constructed by using a plurality of laminated blocks each of which has a plurality of wiring layers and interlaminar insulating layers of polyimide. On a base block having a substrate, the other blocks are laid on top of another, bonded to each other with a polyimide used in each block or another adhesive and electrically connected to each other by using, for example, metal bumps formed on each block. Each of the blocks except the base block is formed on a temporary substrate, and the temporary substrate is removed after bonding each block to the base block or precedingly bonded blocks. This multilayer wiring board can be produced in a shortened time with increased yield. |
申请公布号 |
US5426849(A) |
申请公布日期 |
1995.06.27 |
申请号 |
US19930070923 |
申请日期 |
1993.07.28 |
申请人 |
NEC CORPORATION |
发明人 |
KIMBARA, KOHJI;HASEGAWA, SHINICHI;ISHIDA, HISASHI |
分类号 |
H01L21/48;H01L21/68;H01L23/538;H05K1/03;H05K3/00;H05K3/28;H05K3/32;H05K3/40;H05K3/46;(IPC1-7):H01R9/09;H05K3/36 |
主分类号 |
H01L21/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|