发明名称 Light emitting diode and socket assembly
摘要 A twist-in socket for insertion into a printed circuit assembly has a molded plastic body, conductive paths deposited or plated onto the surface, and an LED and a resistor connected to the paths for energization by the printed circuit. The sockets are molded in arrays, plated to form the conductive paths, the components inserted by automatic machines and flow soldered to the paths, and then individual sockets are snapped off the array. In one embodiment, the LED and resistor have leads extending through holes in the socket to reach the conductive paths. In another embodiment, surface mount components are used, and plated-through holes in the socket couple the path to the surface mount components.
申请公布号 US5427532(A) 申请公布日期 1995.06.27
申请号 US19940312379 申请日期 1994.09.26
申请人 DELCO ELECTRONICS CORPORATION 发明人 OWEN, MARVIN L.;MILLER, MARK J.
分类号 F21V19/00;H01R13/03;H01R33/09;H01R33/945;H05K3/30;(IPC1-7):H01R13/66 主分类号 F21V19/00
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