发明名称 ADHESIVE COMPOSITION FOR FLEXIBLE PCB
摘要 The adhesive for a flexible printed circuit is composed of 70-90 wt% a water soluble or water dispersing polyurethane adhesive and 10-30 wt% a water soluble or water dispersive epoxy compound. The water soluble or water dispersing polyurethane adhesive has more than 20 or 70 wt% acryl polyol of the total polyol, comprises the polymer of polyol of 500-5,000 molecular weight and aliphatic or aliphatic polyisocyanate and butadiene polymer with amino end group, where butadiene is added in 5-10 wt% against the total amount of polyol. The water soluble epoxy compound consists of one or more of aliphatic glycidylether, nitrogen containing heterocyclic epoxy and glycidylether carboxylate, the water dispersive epoxy compound consisting of one or more of novolac type sulfide, cresol type epoxy sulfide and bisphenol A type epoxy sulfide
申请公布号 KR950006914(B1) 申请公布日期 1995.06.26
申请号 KR19910022660 申请日期 1991.12.11
申请人 KOLON IND. INC. 发明人 YUN, YONG - JU;NO, MU - HAK;YU, SANG - HYON
分类号 C09J175/00;(IPC1-7):C09J175/00 主分类号 C09J175/00
代理机构 代理人
主权项
地址