发明名称 ADHESIVE COMPOSITION FOR DICING TAPE
摘要 The adhesive composition for a dicing tape is produced by mixing 22-26 wt.% butyl acrylate, 10.15-11.15 wt.% 2-ethyl hexyl acrylate, 4.0-6.6 wt.% methyl methacrylate, 5.36-6.85 wt.% 2-hydroxy ethyl methacrylate, 4.3-6.52 wt.% vinyl acrylate and 4-12 wt.% benzene in the 0.1 wt.% benzol peroxide catalyst, polymerizing 200 kg monomer mixture with 38-42 wt.% ethyl acetate, adding 2-hydroxyl ethyl methacrylate as a curing agent, tricrexyl phosphate as a catalyst and antinony curing promotor to the polymerized reactant, and then curing it at 90 min.
申请公布号 KR950006911(B1) 申请公布日期 1995.06.26
申请号 KR19940038837 申请日期 1994.12.29
申请人 HANHWA CHEMICAL CO., LTD. 发明人 SO, YONG - OK;PARK, JAE - HYON
分类号 C09J7/02;(IPC1-7):C09J7/02 主分类号 C09J7/02
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