SEMICONDUCTOR DEVICE AND THE MANUFACTURING METHOD

摘要

A semiconductor apparatus with high thermal radiating property and a method for producing the same is provided. The semiconductor apparatus comprises a TAB tape 11 having an inner wire 13 and a middle wire; a semiconductor chip 1 connected to the inner wire 13 through a bump 12; and a lead frame 3 having as an integral structure a middle lead connected to the middle wire 14 and a metallic bed 5 in contact with the semiconductor chip 1. The shape of the bed 5 is nearly constant regardless of the size of the semiconductor chip 1. The bed 5 extends nearly to each outer edge of a sealing plastic resin 2. The heat generated in the semiconductor chip 1 is effectively radiated to the outside through the extending bed 5 of the lead frame 3.