| 摘要 |
<p>PURPOSE:To prevent the outer lead of a semiconductor device by interconnecting an outer lead adjacent to the other outer lead and an insulating body. CONSTITUTION:A semiconductor pellet 2, an inner lead 3A, a bonding wire and the like are sealed with a resin-sealed body 1A which is formed in a square- like surface. The inner lead 3A is formed in one body with an outer lead 3B. The plurality outer leads 3B are arranged along each side of the resin-sealed body 1A outside the resin-sealed body 1A. The inner lead 3A is connected with the outer lead 3B adjacent to the other outer lead 3B. Thereby, the deformation of the outer lead 3B can be prevented.</p> |
