| 摘要 |
PURPOSE:To improve the accuracy of detection of an internal lead and an electrode pad and to cut down the period of detection operation in wire bonding. CONSTITUTION:All the objective inner leads for wire bonding of the lead frame 11, to be conveyed to a bonding station 13, and the area containing the electrode pad on an IC element are imaged by an image-pickup unit 8a, the obtained image information is treated by an image treatment unit 14, and the positions of all inner leads and the electrode pad on the IC element are detected. As a result, a lead frame, a tape carrier, a ceramic package and the like are not subjected to the effect of the deformation of the inner lead caused by conveyance, thermal deformation, thermal expansion and the residual vibration of the image pickup unit the accuracy of wire bonding can be improved, and the time required for detection can also be cut down. |
