发明名称 PLATING SOLUTION FOR SELECTIVE PLATING APPARATUS
摘要 The solution consists of 2˜7% KAu(CN)2 or KAg(CN)2, 0.1˜0.5% H2SO4, 0.1˜0.5% methanol and balance pure water, wherein KAu(CN)2 is used in case of Au plating and KAg(CN)2 is used in case of Ag plating. The solution removes greases and oxides attached on surface of articles being plated with the consequence that the steps of water-cleaning, degreasing and oxides-removing are omitted.
申请公布号 KR950006836(B1) 申请公布日期 1995.06.23
申请号 KR19930003219 申请日期 1993.03.04
申请人 CHOE, KYU - WAN 发明人 CHOE, KYU - WAN
分类号 C25D3/48;(IPC1-7):C25D3/48 主分类号 C25D3/48
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