| 摘要 |
PURPOSE:To enable the bonding wires of all products to be subjected to a tensile strength test through a non-destructive manner. CONSTITUTION:A wire bonding machine is composed of a wire clamp 1 which controls a wire 3 connected between a bonding pad and a lead terminal of a semiconductor chip in tension and a connecting means 2 which connects the bonding pad and the lead together with a wire, wherein a bonding strength test means which tests whether a wire connected by the connecting means 2 is in a prescribed range of bonding strength or not is provided. |
