发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To surely and fully fix the tip of an inner lead by a method wherein an inner lead pressing jig is provided so as to press down the upside of the inner lead tip of a lead frame close to a capillary. CONSTITUTION:A wire bonding machine is equipped with a wire feed means which feeds a bonding wire 15, an ultrasonic horn 16 which supplies ultrasonic energy, and a capillary 17 which presses the bonding wire 15 against a bonding spot. A capillary drive means which moves the ultrasonic horn 16 and the capillary 17 corresponding to the position of a bonding spot and an inner lead pressing jig 18 which is provided to move in a horizontal direction interlocking with the capillary 17 and in a vertical direction independently of the capillary 17 and presses down the upside of an inner lead tip of a lead frame near the capillary 17 are provided.
申请公布号 JPH07161781(A) 申请公布日期 1995.06.23
申请号 JP19930304183 申请日期 1993.12.03
申请人 TOSHIBA CORP 发明人 HARADA SUSUMU
分类号 H01L21/60;H01L21/607 主分类号 H01L21/60
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