| 摘要 |
PURPOSE: To provide a method for manufacturing an M×N electrostrictive actuated mirror array without using a thin electrode ceramic wafer. CONSTITUTION: A ceramic wafer 50 is prepared. This method includes a step for forming M pieces of first trenches on the ceramic wafer 50 in a vertical direction, step for forming M pieces of electrodes, step for forming N-1 pieces of grooves in a horizontal direction, coating with an insulating layer having the N-1 pieces of grooves, and fixing the ceramic wafer on an active substrate, step for forming a metallic layer 58 on the lower face of the ceramic wafer 50, forming a photoresist layer at the upper part of the metallic layer 58, cutting the lower face of the ceramic wafer into N-1 pieces in the horizontal direction, and forming an M×N actuating member array, step for forming second trenches 69 on the lower face of the ceramic wafer in the vertical direction, removing the photoresist layer, and fixing an M×N hinge array 72, step for forming mirrors 76 on the M×N hinge array 72, and step for electric connection.
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