| 摘要 |
<p>PURPOSE:To provide a multilayered board which can be lessened in transient and steady-state thermal resistance. CONSTITUTION:A filling metal 4 is filled in a surface insulating layer 1a as a heat transfer conductor of high thermal conductivity, and a power device 6 is arranged on the filling metal 4. Heat released from the power device 6 is transmitted to the filling metal 4 located at the surface insulating layer 1a and dissipated. The filling metal 4 is formed of mixture of Mo particles of high melting point and aluminum particles.</p> |
