| 摘要 |
<p>PURPOSE:To enhance a large current device in heat dissipating properties, wherein the current device is controlled by a light emitting device, and the heat dissipating plate of the current device is formed of a metal member provided on a light emitting device side. CONSTITUTION:An optical semiconductor device is equipped with a semiconductor light emitting device 1 and a semiconductor photodetective device 2 arranged confronting each other, a large current semiconductor device 3 controlled by the semiconductor photodetective device 2, the electrode members 6 and 9 of the devices 1 and 2, resin-sealed cases 10 and 11 where the electrodes 6 and 9 are led out through their opposed sides, and a heat dissipating plate 4 which is led out of the resin-sealed case in parallel with the electrode member 6 on a semiconductor light emitting device 1 side and arranged inside the resin-sealed case confronting the large current semiconductor device 3 as separate from it by a prescribed space (0.3 to 0.6mm).</p> |
