| 摘要 |
PURPOSE:To realize high speed mounting and to improve reliability of mounted parts by a method wherein the mounting work such as shaping of part leads is simplified, and film-covering for lead protection is omitted. CONSTITUTION:In a surface mount part on which a semiconductor package, having a part lead 9, is mounted on a printed board 1 through the intermediary of an anisotropic conductive bonding film 5, a semiconductor package has a pair of opposing side faces, and part leads 9 provided on the above-mentioned pair of side faces, are formed in horizontal direction with respect to the surface of the board. |
