| 摘要 |
<p>PURPOSE: To avoid short-circuit between bond pads by providing a second hollow so as to be surrounded with a first hollow, within the surface of a semiconductor main body, allowing only a connection surface to be present at the bottom of each of the first and second hollows, and connecting the connection surface to the contact point on the surface of the semiconductor main body through a conductive track. CONSTITUTION: In this semiconductor device, one or more other second hollows 50 are provided on a surface 4 of a semiconductor main body 1, with the hollow 50 surrounded with a first hollow 5, and only one connection surfaces (bond pad) 13 and 12 is allowed to be present at always at bottom parts 7 and 57 of the first and second hollows 5 and 50. These connection surfaces are connected to connections points 3 and 2 on the surface 4 of the semiconductor main body 1 through conductive tracks 11 and 10. Thus, short-circuit is prevented from occurring.</p> |
