Heisspressen dichter keramischer Flachkörper als Ein- und Mehrschichtsubstrate für elektronische Bauelemente.

摘要

Dense ceramic sheets suitable for electronic substrates are prepared by hot pressing ceramic green sheets containing ceramic powder and organic binders which leave no undesirable residue upon pyrolysis in the absence of oxygen. Boron nitride sheets made of boron nitride powder in a similar binder are placed on each side of the ceramic green sheet to form a composite. After hot pressing the composite so as to remove the binder and densify the ceramic, the BN layers are removed. Multiple sheets can be made simultaneously by this technique and multilayer ceramic electronic substrates can be produced with internal interconnections between the metal circuits at the various layers by depositing metal circuit patterns on the green sheets such as by screen printing.