| 摘要 |
<p>PURPOSE:To raise the reliability on connection between terminals by arranging absorbing the misalignment of the terminals of a ceramic board with the terminals of an integrated circuit due to the variation of the sintering shrinkage factor at baking by devising the shape and arrangement of a metallized layer for the terminal for connection of the board. CONSTITUTION:The shape, when viewed from above, of each metallized layer 3 of a group 2 of metallized layers 3 for connection terminals of a ceramic board 1 is made into an ellipse being long inward and outward from the center 3c in design of each connection metallized layer 3, and besides the connection metallized layers 3 are arranged radially from the center C of its group 2.</p> |
