APPARATUS FOR HEATING OR COOLING WAFERS

摘要

Gas-loaded thermal conditioning is used to cause the temperature of a substrate (20) to approach that of a high thermal inertia temperature-controlled plate (22 or 106) by adjustable pressure of gas above the substrate (20), so as to press the substrate (20) against the plate (22 or 106). There is no mechanical contact with the substrate (20) except the plate (22 or 106) which it rests on, and there is no danger of overheating or overcooling.