Heat dissipation element for electronic component

摘要

The component (3) to be thermally protected is mounted on a circuit board (2) in a car combined instrument and has a heat radiating face which is formed by a clamping spring (5) with a heat absorbing surface (6), gripping over the component and abutting with its large surface on the component. Pref. the clamping spring has opposite clamping arm pairs (11) shaped like count times at the side of the heat absorbing surface for securing a flexible conductive foil (4) on the circuit board. They grip from two sides over the circuit board.