Semiconductor laser

摘要

A resin-moulded semiconductor laser which eliminates lateral displacement of the laser beam emitting point and can be mounted in the same way as a canned semiconductor laser, comprises a resin sealing body having a flat portion (25) covering a main portion of a laser diode element and a planar portion (26) integrally moulded with the flat portion (25) and covering the connecting leads (12) on their terminal side. The top and bottom surfaces as well as the side faces of the flat portion (25) are arranged symmetrically with respect to the centre of alignment of the connecting leads (12), while the outer periphery of the flange portion (26) has a centre of curvature which coincides with the laser beam axis. The symmetrical arrangement of the flat the portion (25) suppresses displacement of the laser beam emitting point caused by thermal stress and the flange portion (26) facilitates mounting of the laser in mounting mechanisms of optical apparatus in the same way as conventional canned semiconductor lasers.