Laminated interconnect tape

摘要

A flexible laminated interconnect tape is suitable for use as an electrical interconnecting medium between electronic components and between bonding pads of integrated circuit die and IC packaging bond pads. The tape may be used as a modification to existing TAB (tape automated bonding) tape technology, or as a substitute to wire bond technology. The flexible laminated tape comprises a plurality of conductor layers (40)(a - y) eg of Al, each separated from adjacent conductor layers by a polymeric insulating layer (42)(a - z). The tape offers improvement to bonding processes by simplification of the requirement to create compatible metallurgies at the bond sites. By using vacuum deposition techniques to form the electrical conductor a wider range of materials (and characteristics) is made available for electrical interconnect. Benefits may also follow in the high-frequency signal transmission between interconnected components by reducing "skin effect" attenuation; this laminated tape could be regarded as an evolution of Litzendraht Wire.