Process of making thin and thick metallic layers.

摘要

The present invention relates to a method of forming, on a substrate, first metallic regions (M1-1, M1-2) of a first thickness, and second metallic regions (M1-10/M2-10) of a second thickness greater than the first thickness, comprising the steps consisting in depositing a first metallic layer (2) of the first thickness; depositing a layer (11) of a material which can be etched selectively with respect to the metal; photoetching the said material along the contour of the first regions; depositing a second metallic layer (7); forming a masking layer (14) along the contour of the second regions; etching the first and second metallic layers.