| 摘要 |
A heat sink equipped semiconductor for package in which the heat sink has a plurality of flat plates (7a, 7b) arranged in a row, and both end plates (7a) have a rectangular shape, while those plates (7b) located between the end plates (7a) are each an inverted trapezoid having the bottom side shorter than the top side. The spacings between the plates (7a,7b) causes a pressure drop which prevents the air from escaping around the heat sink and allows the air to easily flow through the bottom portions of the plates (7a,7b). The cooling air therefore leaks outside less, and passes through the spacings between the plates, increasing the cooling performance of the heat sink and improving the cooling efficiency of the package. <IMAGE> <IMAGE> |
