| 摘要 |
PURPOSE:To provide a lapping carrier which is sufficient in strength and able to hold a wafer with no damage and obviate the replacement of a synthetic resin coating film in the peripheral edge part of a holding hole and a guide member. CONSTITUTION:An inner circumferential surface 21 of a holding hole 2 is ground and smooth surfacing is applied, thereby installing a smooth surface 21a, and projections are removed, and further both vertical edges on the inner circumferential surface of the holding hole 2 is chamfered, installed a chamfering part 23 there. A wafer peripheral surface and the inner circumferential surface of the holding hole, therefore, come to a face-to-face contact. |
