WOVEN GLASS FIBER FABRIC FOR RESIN-REINFORCEMENT

摘要

PURPOSE:To obtain a reinforcing glass fiber for printed circuit board having excellent adhesivity to a matrix resin and high soldering heat-resistance after moisture-absorption by treating the surface of a woven glass fiber with a specific silane coupling agent, thereby forming a coating film on the surface. CONSTITUTION:The surface of a heat-cleaned woven glass fiber fabric is treated with a silane coupling agent composed of a disilyl compound containing amino group, having alkoxysilyl groups at both terminals and expressed by formula (R is a 1-2C univalent hydrocarbon group; X is a 1-2C alkoxy; (m) is 1-4; (n) is 0, 1 or 2). A bonding coating film having chemical bond is formed on the surface of the glass fiber by this process to improve the adhesivity of the fiber to a thermoplastic or thermosetting matrix resin. The obtained woven glass fiber fabric for resin reinforcement has excellent adhesivity to resins and gives a laminated board for printed circuit board having especially excellent soldering heat-resistance of the board after moisture-absorption. The fiber is especially suitable for the production of a thin laminated sheet.