发明名称 RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR
摘要 PURPOSE:To obtain the subject composition comprising a specific epoxy resin, a curing agent and a curing accelerator, excellent in transparency, moisture resistance, thermal cycle resistance, and prevented in the deterioration of light transmittance in the near IR light region. CONSTITUTION:This composition comprises (A) an epoxy resin containing an epoxy resin of the formula (R is H or methyl), e.g. 3,3',5,5'-tetramethylbiphenol diglycidylether, in an amount of 10-40wt.% based on the whole amount of the resin, (B) a curing agent such as a multibasic carboxylic acid anhydride, and (C) a curing accelerator such as trimethylamine.
申请公布号 JPH07157541(A) 申请公布日期 1995.06.20
申请号 JP19930310145 申请日期 1993.12.10
申请人 SUMITOMO BAKELITE CO LTD 发明人 ASADA YASUTSUGU
分类号 C08G59/18;C08G59/20;C08G59/24;C08G59/32;H01L23/29;H01L23/31;H01L33/56 主分类号 C08G59/18
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