| 摘要 |
PURPOSE:To effectively prevent flowing-in and adhesion of a sealing medium to a contacting region with a read lead, by performing a simple additional processing. CONSTITUTION:A lead frame for an IC card is comprised by arranging at least one conductive pattern which is provided with a chip mounting side part possessing a die pad side part on a surface side in which an IC chip is mounted and at least two lead parts 21, 22 and the chip mounting side part 1 and lead parts 21, 22 each are divided by fixed gap parts 311, 321. Then a groove part is formed on the rear side of the chip mounting side part to the outer circumferential line coming into contact at least with the gap parts 311, 321 each and a groove part is formed on the rear side of the lead parts 21 each to the outer circumferential line coming into contact at least with the gap parts 311, 321 each. Then an electronic part mounting device for which the same is used is provided. |
