发明名称 RESIN SEALING MOLD
摘要 PURPOSE:To provide a resin sealing mold suitable to resin sealing for a lead frame having no tie-bar. CONSTITUTION:A lead frame clamp face 2 extends to a position of a tie-bar. At the outer side of the lead frame clamp face 2, a sub-clamp face 3 lower than the lead frame clamp face 2 extends to an end face of a lead. The outer side of the sub-clamp face 3 is made to be a bearing bypass 4.
申请公布号 JPH07156207(A) 申请公布日期 1995.06.20
申请号 JP19930310236 申请日期 1993.12.10
申请人 NEC CORP 发明人 GOTO HITOSHI
分类号 B29C45/26;B29L31/34;H01L21/56;H01L23/50;(IPC1-7):B29C45/26 主分类号 B29C45/26
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