发明名称 Contact element for a printed-circuit board relay, and a method for its production
摘要 PCT No. PCT/DE92/00073 Sec. 371 Date Aug. 17, 1993 Sec. 102(e) Date Aug. 17, 1993 PCT Filed Nov. 2, 1993 PCT Pub. No. WO92/15107 PCT Pub. Date Sep. 3, 1992.The contact element (10) is formed from a round wire, this round wire being bent in the shape of a hairpin having two parallel limbs (11, 12), at least one of which is used as a soldering connecting pin. The curved region between the two pins is stamped flat to form a common contact zone (14) having a flat surface, and is provided with a contact piece. In consequence, heavy-current contacts can be constructed particularly favorably with printed-circuit board connections.
申请公布号 US5426272(A) 申请公布日期 1995.06.20
申请号 US19930107680 申请日期 1993.08.17
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 HENDEL, HORST
分类号 H01H1/06;H01H11/04;H01H50/54;(IPC1-7):H01H1/00 主分类号 H01H1/06
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