| 发明名称 |
Selective addition of a solder ball to an array of solder balls |
| 摘要 |
A specially designed tip containing an electron discharge milled cone of specific dimensions is used to transfer a critical solder volume from a solder ball carrier to a specific solder ball site on the base line metal on a high density chip, substrate terminal connection, solder ball connection, or any solder ball array. The critical tip/cone dimensions have a height of the cone and a circumference at the base which generate a specific volume of solder to be transferred.
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| 申请公布号 |
US5425493(A) |
申请公布日期 |
1995.06.20 |
| 申请号 |
US19940288520 |
申请日期 |
1994.08.10 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
INTERRANTE, MARIO J.;ECONOMIKOS, LAERTIS |
| 分类号 |
H01L21/66;B23K3/06;H01L21/00;H01L21/60;H01L21/607;H05K3/34;(IPC1-7):H01L21/607 |
主分类号 |
H01L21/66 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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