| 摘要 |
In an electronic component such as a multilayer ceramic capacitor having an external electrode which is formed on an outer surface of an element body provided with an internal electrode, an inner layer is formed by baking silver paste, for example, on only an end surface of the element body to be connected to the internal electrode, in order to provide a sufficient thickness to the external electrode for reducing dc resistance while avoiding a bad influence exerted by wet plating. An outer layer is formed by dry plating to cover the inner layer and an end portion of the element body. The outer layer is formed by a first layer of a nickel alloy, for example, and a second layer of silver, for example.
|
