| 摘要 |
PURPOSE: To improve mounting efficiency by arranging inner lead portions of a plurality of leads, so as to extend horizontally and mount and adhere at least two semiconductor chips onto the inner portions through at least two insulating adhesives. CONSTITUTION: Inner lead portions 31 of leads 33 are alternated in such a manner ' that the inner lead portions partially coincide each othir in a horizontal direction at least bY twos. A plurality of sets, each consisting of at least two insulating pressure sensitive adhesive double coated tapes 32, are adhered onto the portions 31, and the leads 33 are fixed on the tapes 32. Then, semiconductor chips 34 are mounted and adhered onto the tapes 32. Successively, wires made of, e.g., silver or gold are obliquely bonded, so that bonding pads 35 of the chips 34 are electrically connected to the portions 31. A package body 30 is thereafter formed by sealing with an EMC, in order to protect wire-bonded regions and semiconductor chip regions. |
