| 摘要 |
PURPOSE:To make it possible to mount an electronic component on a board with reliability in a simple step, by forming a solder bump electrode on a gold bump electrode in a wire-bonding method. CONSTITUTION:In a manufacturing step, a first gold bump electrode 6 is formed in a wire-bonding method with a capillary 8. The first gold bump electrode 6 is formed on a pad electrode 4 of a silicon-chip electronic component body 2. In addition, a second bump electrode 7 is formed on the first bump electrode 6. In this case, the second bump electrode 7 is formed in a similar productive step except for a solder fine wire used in the second bump electrode 7, instead of a gold fine wire used in the first bump electrode 6. In these steps, when the second bump electrode 7 is formed on the first bump electrode 6, a silicon- chip electronic component 1 with a bump electrode 3 is completed. |
