| 摘要 |
PURPOSE:To provide a lead frame wherein the generation of the defective of a semiconductor chip can be reduced while the generation of its crank is reduced. CONSTITUTION:A lead frame is provided with a frame 5, twelve leads 4 extending inward from the frame 5, a rectangular die pad 1 provided on the inside of the frame 5 but not in contact with the leads 4, and die supporters 6 for connecting the die pad 1 with the frame 5. In this lead frame, by the providings of architraves 3 on the end parts of the die pad 1 which are present along its two long sides, the resistances of the die pad 1 to the bendings which are applied to it in the direction of its long side and in the neighboring direction thereto are improved. |
