| 摘要 |
PURPOSE:To enable highly efficient economic production of a printed wiring board excellent in adhesion to a plating metal, heat resistance, and connection reliability by employing a metal having etching conditions different from those of copper on the surface of a metal layer for transferring the profile of rough surface. CONSTITUTION:A quite thin metal layer 2 having rough surface and different etching conditions from those of copper is formed on a support 1 which is then laminated integrally with an insulating board material 6 through the rough surface. The support 1 and the metal layer 2 are then removed from the insulating board material 6 by etching while leaving the profile of rough surface thereon. A circuit conductor 9 is then formed by electroless plating at a required part on the surface of the board material 6 onto which the profile of rough surface is transferred from the metal layer 2. The support 1 is made of a copper foil and the metal layer 2 is made of an Ni layer, for example. The insulating board material 6 having an inner layer circuit 4 on a resin board 5 is then laminated, on the opposite sides thereof, with the support 1 having the metal layer 2 through a prepreg 3. |
