| 摘要 |
PURPOSE:To obtain a compression-bonded semiconductor device wherein there is no deviation in position between a semiconductor substrate and a heat- compensating board and no insulating holding material exists between the semiconductor substrate and the heat-compensating board and to provide a method suitable for manufacturing such a device. CONSTITUTION:On an upper principal plane of a first heat-compensating board 31, a first stage 31c and a second stage 31a are formed in this order concentrically from the outer part towards the center. At the inner corner of the first stage 31c, a corner groove 31b is formed like a ring covering the entire circumference. Since the corner groove 31b does not exist on a contact face between a semiconductor substrate and the heat-compensating board 31, the semiconductor substrate and the heat-compensating board 31 can be brought into good electric contact and no stress is applied to the semiconductor substrate locally when the semiconductor substrate and the heat-compensating board 31 is compression- bonded. |
