Inertial sensor assemblies

摘要

The sensor assembly includes a number of planar members supporting respective inertial sensors, and formed with surface formations arranged to engage one another to retain the planar members in an angular relationship with one another. The surface formations are provided by alternate projections and recesses along the edge of the planar members. The rigidity and structural integrity of the assemblies depends on the geometry of the joining forms and the nature of electrical connections provided by the pads between the chips. The pads on the chips could be connected by solder plugs or wire bonding or using electrically conductive tangs, interlocking edge-lap joining forms or residual interference fit stress pressure.