IC card.

摘要

An IC card (21) includes a substrate (13), semiconductor devices (1a-1h) mounted on at least one of majors surfaces of the substrate, and a casing in which the substrate with the semiconductor devices mounted on it is housed. The casing includes a frame (5) and panels (7, 8) bonded to the frame on the opposite sides of the frame by means of adhesive layers (9a, 9b). Means for preventing the semiconductor devices from being bonded to the panel via the adhesive layers are disposed at locations on the adhesive layers facing the semiconductor devices.