METAL WIRE STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

The method forms a lower wiring film and a strap pattern in the contact hole of a semiconductor device. The method has the steps of laminating a strap pattern and a lower wiring film on the substrate, forming an oxide insulating film, forming the contact holes with a lower wiring film through the oxide film, and attaching the upper and the lower wiring films. The strap pattern prevents the damage of wires from excessive etching.