| 摘要 |
EMF shielding is provided for a logic board (13) having a number of integrated circuit units (30,35,38,40,32) surface mounted to the logic board (13). The logic board is a laminate of a number of circuit layers. The integrated circuits surface mounted to the top circuit layer are a microprocessor (30), a number of memory units and an application specific integrated circuit surface. Additional circuit components are mounted to both the top and bottom circuit layers. Electrical lines provide electrical communication perpendicularly between the circuit layers and horizontally on the surface of the respective layers to and from the integrated circuits. The top circuit layer has a conductive material (19) formed contiguously around the integrated circuits mounted to the top layer of the logic board (13) and a top cover composed of EMF shielding material is fixably mounted to the logic board (13) to enclose the integrated circuits mounted to the top layer of the logic board (13). The periphery of the top cover is in contiguous contact with the conductive material (19). In like manner, the bottom circuit layer has a conductive material formed contiguously around the integrated circuits mounted to the bottom layer of the logic board and a bottom cover composed of EMF shielding material fixably mounted to the logic board to enclose the integrated circuits mounted to the bottom layer of the logic board. <IMAGE> |
