Tape attaching apparatus for semiconductor lead frame

摘要

A tape attaching apparatus for a semiconductor lead frame includes a bonding tape drier 12 to heat and dry bonding tape under a high temperature just before a tape attaching process for the semiconductor lead frame, and a bonding tape protector 13 which protects the dried bonding tape from the ambient atmosphere until just before the bonding tape is attached to the lead frame, thereby preventing the formation of air bubbles and improving the adhesiveness of the bonding tape. The apparatus is especially effective in attaching thermoplastic bonding tape to a lead-on-chip lead frame.