发明名称 POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE COMPOSITION AND THEIR PRODUCTION
摘要 <p>PURPOSE:To obtain the thixotropic composition low in hygroscopicity, dielectric constant and residual stress, useful for screen printing, etc., by heating a polyamic acid solution prepared by mixing an aromatic tetracarboxylic acid component, aromatic diamine with an oxygenated solvent. CONSTITUTION:This thixotropic polyimide precursor composition can be obtained by heating a polyamic acid solution prepared by mixing or reaction between (A) an aromatic tetracarboxylic acid component composed of (1) >=50mol% of a benzenetetracarboxylic acid dianhydride, biphenyltetracarboxylic acid dianhydride, terphenyltetracarboxylic acid dianhydride, benzophenoltetracarboxylic acid dianhydride or a reactive derivative therefrom and (2) <=50mol% of another tetracarboxylic acid dianhydride or a reactive derivative therefrom, (B) an aromatic diamine component composed of (3) >=50mol% of 2,2'-bis(trifluoromethyl)diaminodiphenyl or a reactive derivative therefrom, (4) 1-10mol% of a siloxydiamine compound and (5) another diamine, and (C) an oxygenated solvent.</p>
申请公布号 JPH07149895(A) 申请公布日期 1995.06.13
申请号 JP19930296992 申请日期 1993.11.26
申请人 CENTRAL GLASS CO LTD 发明人 NANAI HIDETOSHI;MOROI NAGAHIRO;TAKAHASHI HIROSHI;HASEGAWA SEIJI;MARUTA TOSHIMICHI
分类号 B41M1/12;B41M7/00;C08G73/10;C08G73/12;C09D11/033;C09D11/10;C09D11/102;H01L23/498;H01L23/532;H05K3/28;(IPC1-7):C08G73/10 主分类号 B41M1/12
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