Photosensitive resin composition

摘要

A photosensitive resin composition includes (A) a hydrophobic polymer having a glass transition temperature not greater than 5 DEG C., (B) a hydrophilic polymer, (C) an ethylenically unsaturated compound, (D) a solvent capable of dissolving the component (B) more than the component (A) and (E) a photopolymerization initiator, with the content of component (B) being less than that of component (A). The resin composition can be used to prepare a printing plate having a base, a photosensitive resin layer and a covering layer arranged one over another. The photosensitive resin layer contains a dispersed phase which includes particles having a phase which includes a hydrophobic polymer, surrounded by a phase which includes a hydrophilic polymer. The photosensitive resin layer can be prepared by removing the solvent (D) to a content of 0.001-2% by weight.